LOCTITE® 315 is a blue, one component thermally conductive acrylic adhesive paste, designed to bond heat-generating electronic components to heat sinks using a consistent self-shimming gap for both insulation and effective heat transfer
LOCTITE® 315 is engineered for high-performance electronic assembly where thermal management is critical. The paste formulation creates a controlled 5–6 mil gap between the component and heat sink, offering high thermal conductivity (0.808 W/m·K) while maintaining electrical insulation. The adhesive cures via activator (typically LOCTITE® 7387), enabling controlled bond strength that supports field servicing and repairs. Initially high viscosity for precise self shimming application is followed by cure yielding reliable shear strength (>6.9 N/mm² on steel after 72 hours). It is especially suited for transformers, power transistors and other heat-generating parts in circuit board assemblies. Performance parameters include dielectric strength of approximately 26.7 kV/mm and specific gravity around 1.66 at 25 °C, making it ideal where both thermal conduction and electrical isolation are required
Appearance: blue high viscosity paste
Specific gravity: approximately 1.66 at 25 °C
Viscosity: 360 000 to 850 000 mPa·s (Helipath spindle, 20 rpm)
Coefficient of thermal conductivity: 0.808 W/m·K
Dielectric breakdown strength: ~26.7 kV/mm
Lap shear strength (steel): ≥ 6.9 N/mm² after 72 hours with activator
Primary Chemistry: Modified acrylic (thermally conductive paste)
Allows effective thermal transfer while preventing short circuits under electronic modules Ensures consistent thermal interface gap for repeatable heat sink performance Supports reworkable assemblies without trade-off in adhesion Reduces risk of thermal degradation in sensitive components over time
Apply LOCTITE® 315 paste between an electronic component and heat sink to create a consistent insulating gap. Use LOCTITE® 7387 activator to accelerate cure and bonding. The product self shims to maintain proper gap dimensions and thermal conductivity. Allow full cure (up to 72 hours) before applying load or servicing. Ideal for bonding transformers, power transistors or other components requiring thermal dissipation and insulation.
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